In the new inVISION issue 3 / 2021 (June) the focus is on high speed interfaces (10GigE, CoaXPress, PCIe), smart cameras, lenses & lighting, thermography and 3D vision. Also hema electronic is present with an interesting topic: Multisignal processing in embedded vision systems.
The requirements for mobile or compact electronics for multisignal processing in embedded systems are complex. Hema electronic has therefore developed an embedded vision design platform. Customers select their required interfaces and functionalities and configure their individual electronics, which are then produced within six weeks.
Read our article in inVISION 3/2021: View PDF